Bob Cole

Electrical/Electronic Manufacturing

Bob Cole has been working as a Director, Packaging Engineering in Fidelica Microsystems since 2003. Moreover, Bob Cole has professional experience at more than four companies using similar skills. Bob has a total work experience of 19+ years. Bob Cole studied at the University of California, Berkeley from 1982 to 1986. Bob Cole can be found in San Francisco, California – where this expert currently lives. You can search for the professional's contacts. We can also provide you additional contact information upon request.
Name variants:
Robert Cole
Last updated Jul 04, 2024

Contact Information

Last Update
Jul 5, 2022
Email
bo**@gmail.com
Location
San Francisco, CA

Workplace

Director, Packaging Engineering

Industry

Semiconductors

Work History

Director, Packaging Engineering

Product development for flexible fingerprint sensor and smart card. Developed customer specific smart card architectures. Set up internal prototype lines, worked with high volume subcontra...
Feb 2003 — Aug 2007

Manager, Packaging Development

Apr 1999 — Oct 2002

Director, Slider Fab Engineering

1997 — 1999

Engineering Manager, Advanced Manufacturing

1987 — 1997

Education

Occupations

Executive
Director
Sales Specialist
Equipment Tools Purchasing Agent
Manager
Operations Manager
Department Store Salesperson
Retail Salesperson
Login