Decision Makers
Director Tps
Eddie Sterpka is in charge of making strategically valuable choices for Tango Systems. E-mail: e****@gmail.com, Phone: 14085262330 is available on SoftwareOfficial.
Director, Process Development And Engineering
This person is responsible for choosing valuable development path. E-mail: t****@outlook.com, Phone: 14085262330 is available on SoftwareOfficial.
Director Strategic Alliances
Louise Coon is in charge of choosing strategically important development path. E-mail: l****@thunderbird.com, Phone: 14085262330 is available on SoftwareOfficial.
Company Details
Last Update
Jul 13, 2022
Doing business as
TANGO SYSTEMS, INC
Location
2363 Bering Dr, San Jose, CA 95131
Phone
(***) ***-2330
Industry
Semiconductors
Engineering Services
Mfg Semiconductors/Related Devices
Specialties
Advanced Sputtering technologies
Advanced Packaging: TSV, Interposers, WLP
Sputtering for substrates: PWB, Glass
Thin Film Shielding technologies (EMI)
Founded
2005
Number of Employee
11-50 employees
NAICS
531 - Real Estate
FAQs about decision-makers at Tango Systems
Where is Tango Systems`s office currently situated?
The company Tango Systems address is in San Jose, California state.
What are the industries connected with Tango Systems?
The industries connected with the company Tango Systems are Semiconductors, Engineering Services, and Mfg Semiconductors/Related Devices.
What is the known phone of Tango Systems?
The phone number of the company Tango Systems decision-makers is 14085262330.
Who are the decision-makers in Tango Systems?
The decision-makers of this company are Tn Arunagiri, Eddie Sterpka etc.
What are the specialties of the main decision-makers in Tango Systems?
The professions of the company decision-makers are Director Tps or Director, Process Development and Engineering etc.
What can be the alias of Tango Systems?
The alias for the company Tango Systems is TANGO SYSTEMS, INC.
What are the fields for Tango Systems?
The special fields for Tango Systems are Advanced Sputtering technologies, Advanced Packaging: TSV, Interposers, WLP, Sputtering for substrates: PWB, Glass, Thin Film Shielding technologies (EMI), and EMI shielding thick metals